High-Frequency Circuit Design For Power Electronics In Modern Communication Devices
DOI:
https://doi.org/10.63278/mme.vi.1597Keywords:
High-Frequency Circuit Design, Power Electronics, Communication Devices, Signal Integrity, Impedance Matching, Thermal Management, Gan, Sic, Miniaturization, Performance Evaluation.Abstract
In the rapidly changing world of modern communication devices, high-frequency circuit design is crucial to the successful working of the power electronics. These circuits are vital in improving the performance and the energy consumption of the communication systems, in wireless communication, satellite communication and mobile phones. This paper describes the developments in high-frequency circuit design used in the power electronics of modern communication devices. It discusses challenges of operations such as high-frequency signal integrity, impedance matching, thermal management, and miniaturization. The study presents an exhaustive review of different design methodologies, circuit topologies and materials that are adopted in the high-frequency power electronics that are proceeded by detailed metrics of their performance. The findings underscore the necessity of incorporating advanced technologies like gallium nitride (GaN) and silicon carbide (SiC) into design procedures that will produce better power efficiency and less heat dissipation.
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Copyright (c) 2025 Dr. M. Madhusudhan Reddy, Dr. Ranadheer Reddy Ragidi, Nagalakshmi Yarlagadda, Dr. Jaghannath.K, Mr.G. Poshamallu, Dr. D.Jayahar

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