Zarchi, M. et al. 2013. Characterization of the SiO2 film deposited by using plasma enhanced chemical vapor deposition (PECVD) with TEOS/N2/O2. Metallurgical and Materials Engineering. 19, 4 (Dec. 2013), 287–294. DOI:https://doi.org/10.63278/10.63278/mme.v31.1.