[1]
M. Zarchi, M. Z. Sanjari, and S. Ahangarani, “Characterization of the SiO2 film deposited by using plasma enhanced chemical vapor deposition (PECVD) with TEOS/N2/O2”, Metall Mater Eng, vol. 19, no. 4, pp. 287–294, Dec. 2013.